I need a clean, highly detailed 3D model of a semiconductor at the chip level. The goal is strictly visualization, so accuracy in visible structures, proportions and materials takes priority over simulation-ready geometry. You will receive the reference drawings and any dimensional data I have as soon as we start; feel free to suggest additional views or measurements that will help you model the die, package and bond-pad layout convincingly. Realistic materials, basic lighting and camera setups that make the chip look photorealistic in standard renderers are welcome, but polygon efficiency is less important than visual clarity. Deliverables • The finished chip-level 3D model in a commonly-used format we agree on up front (OBJ, STL, native CAD or similar) • A short note describing the layer structure, material shaders and any textures applied • Two or three high-resolution still renders showing the model from key angles for immediate presentation use I will review the model for dimensional consistency with the supplied references, correct component placement and overall visual fidelity. Once those points are met, we are good to release final approval.